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Power chips are attached to exterior circuits through packaging, and their performance relies on the assistance of the packaging. In high-power circumstances, power chips are typically packaged as power components. Chip affiliation refers to the electric link on the top surface area of the chip, which is typically light weight aluminum bonding wire in conventional modules. ^
Typical power component bundle cross-section

At present, industrial silicon carbide power components still mostly use the product packaging modern technology of this wire-bonded standard silicon IGBT module. They deal with troubles such as big high-frequency parasitical criteria, inadequate warmth dissipation capability, low-temperature resistance, and inadequate insulation toughness, which restrict using silicon carbide semiconductors. The display of exceptional efficiency. In order to fix these problems and totally manipulate the substantial prospective advantages of silicon carbide chips, several brand-new packaging technologies and solutions for silicon carbide power modules have actually arised in the last few years.

Silicon carbide power module bonding technique

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have actually developed from gold cable bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually developed from gold cords to copper cords, and the driving force is price reduction; high-power tools have actually developed from light weight aluminum cords (strips) to Cu Clips, and the driving pressure is to enhance item efficiency. The higher the power, the higher the demands.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that uses a strong copper bridge soldered to solder to link chips and pins. Compared to standard bonding product packaging techniques, Cu Clip technology has the complying with advantages:

1. The connection between the chip and the pins is made from copper sheets, which, to a specific level, replaces the standard cord bonding approach between the chip and the pins. Therefore, a distinct package resistance worth, greater present flow, and far better thermal conductivity can be acquired.

2. The lead pin welding location does not require to be silver-plated, which can fully save the expense of silver plating and inadequate silver plating.

3. The item appearance is completely regular with normal items and is mostly made use of in servers, portable computers, batteries/drives, graphics cards, electric motors, power supplies, and various other areas.

Cu Clip has 2 bonding methods.

All copper sheet bonding technique

Both eviction pad and the Source pad are clip-based. This bonding method is much more pricey and complex, yet it can achieve far better Rdson and far better thermal effects.

( copper strip)

Copper sheet plus wire bonding method

The source pad uses a Clip approach, and eviction uses a Cable approach. This bonding approach is slightly less expensive than the all-copper bonding method, saving wafer area (relevant to extremely small gateway areas). The process is easier than the all-copper bonding approach and can obtain much better Rdson and better thermal effect.

Vendor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper welding, please feel free to contact us and send an inquiry.

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